Who verifies the verifier? This is the age-old question for anyone involved in the verification of semiconductor systems. Who ...

Rise in complexity is pushing engineers to validate hardware, software, and physical constraints earlier in the design flow, but fragmented workflows make that difficult.

HBM shortages threaten AI expansion; TSMC weighs price hikes; advanced packaging ramps; domain-specialized AI models; Infineon and UMC boost fab investments; Intel's quantum move; Lam and imec advance ...

Technology is only useful if it improves an existing methodology. Property generation is still refining that goal, but in the ...

Shift left is becoming less linear. Instead of locking down specifications early, design teams may be able to refine architectures and implementation choices as new information becomes available.

Solving difficult bugs while intelligently deciding what to investigate, what to rerun, and where to spend compute.

Physics-based analysis becomes more consequential as chips, packages, boards, and systems are designed together.

Advanced packaging requires models to cross company boundaries without exposing proprietary processes, but hiding too much ...

STCO for heterogeneous design; physical AI interactions; signing off AI-generated designs; workload profile analysis.

Pinpointing failures, ensuring known-good optical engines, and controlling test costs become increasingly critical as photonics moves into advanced packages.

Researchers at Chinese Academy of Sciences, Jilin University, State Key Laboratory of Advanced Manufacturing for Optical ...

Researchers at KU Leuven, Kunsan National University, Vrije Universiteit Brussel, imec, et al. published “Irradiation-Source-Dependent Tone Conversion in Dry-Deposited Halogenated Amorphous Zeolitic ...